At Lockheed Martin, we apply our passion for purposeful innovation to keep people safe and solve the world's most complex challenges. From aerospace to outer space to cyber space, you can solve the world's most complex challenges for our customers. Our culture of performance excellence, ethics and teamwork is embedded in everything we do.

Designs the physical layout of complex printed circuit boards (PCBs)—including high-speed digital, RF/microwave, and power designs—as well as thick-film or thin-film modules from engineering inputs (schematics, models, mechanical constraints, and written/verbal specifications) in accordance with company, IPC, and government standards. Collaborates closely across Electrical Engineering, Mechanical Engineering, Simulation/Signal Integrity, and external PCB fabricators from initial concept through manufacturing release. Generates and checks complete manufacturing and engineering drawing packages.

Joining Lockheed Martin means becoming part of a team that's making a significant impact in the field of engineering. When you choose to work with us, you'll enjoy:

•An excellent working environment equipped with state-of-the-art tools.

•The opportunity to work alongside industry leaders and top-notch professionals.

•A chance to be a part of solving some of the world's most challenging engineering problems.

•A culture that encourages creativity, excellence, and the development of remarkable products.

If you're ready to take your career to the next level, work on groundbreaking projects, and be a part of a team that thrives on innovation, we encourage you to apply and be a part of our mission.

• 5 to 10 years of professional experience designing complex PCB layouts across high-speed digital, RF, and power applications.
• Proficiency in modern ECAD layout tools (such as Siemens Xpedition, Altium Designer, and/or Cadence Allegro), with the ability and willingness to use Siemens Xpedition as the primary design tool.
• Working knowledge of AutoCAD for board outline definition and custom RF shape creation.
• Experience creating complete PCB fabrication and assembly drawing packages using BluePrint-PCB or Altium Draftsman.
• Strong understanding of PCB layer stackup creation, controlled impedance, and proper routing/return-path practices.
• Experience interfacing with PCB fabricators and processing fabricator Technical Queries (TQs).

• Familiarity with circuit electric design principles
• Utilizing CAD tools to generate circuit card schematics, layouts, and drawings
• Ability to check design data (Design Rule Checking)
• Microsoft Office program suite
• Teamwork and Communication

• Familiarity with government/aerospace and IPC standards (e.g., IPC-6012, IPC-2221, IPC-A-610).
• Experience collaborating on 3D ECAD/MCAD co-design and supporting SI/PI/RF simulation workflows.
• Direct hands-on experience with Siemens Xpedition and DownStream BluePrint-PCB.
• Industry certifications: IPC CID, IPC CID+, or PCEA CPCD (Certified Printed Circuit Designer).